R&D Assistant Project Manager (Semicon equipment experience)

  • Job category
  • Job level
  • Contract type
    Permanent, Full Time
  • Location
  • Salary
    S$4500 - S$6200

Job Description

Job Responsibilities

  • The project manager is coordinating mainly hardware and software related projects with the focus on a continuous improvement of Die bonder machines especially in context with performance improvement, cost reduction and functionality enhancement.
  • In his function he/she is managing projects and sub projects according to the Die Attach Product Innovation Process (DAPI) by considering of proven methods, risk management and standards (Semi S2, Semi S8, CE).
  • He/she is responsible for project planning and periodical controlling of targets, risks, milestones, costs and resources. In addition he/she performs project & review meetings and creates periodical reports for the steering committee and other stakeholders involved in the project.
  • He/she is coordinating the information flow within the project, to the project owner, to external participants and to the production sites in Asia.
  • In his/her role as sub project manager he/she is the interface for project coordination between the different Rnd locations and also responsible for the series introduction of projects started from other Rnd sites.

Job Requirements

  • Bachelor degree from Mechatronic, Electrical or Automation.
  • Minimum 2 years work experience, prefer in semiconductor back end with experience in project management.
  • Excellent command of English

We regret that only shortlisted candidates will be notified.

To apply, please click "Apply Now" or visit www.gmprecruit.com and search for job reference: 17825

GMP Technologies (S) Pte Ltd   |   EA Licence: 11C3793   | EA Personnel:  Lim Zi Cheng  |   Registration No: R2089949

Closing on 18 Mar 2021

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